Identify Fault
Remove Chip
Clean Pads
Reball
Reinstall
Test
This guide explains the correct process to reball VRAM chips on GPUs, typically required when memory faults are caused by bad solder joints.
Step 1: Confirm VRAM Fault
- Run MATS / MODs to identify faulty memory bank
- Look for artifacts, crashes, or memory errors
- Check memory voltage rail stability
If errors point to a specific memory chip → proceed with reballing.
Next: Mark the faulty VRAM chip location before removal.
Step 2: Remove VRAM Chip
- Apply flux around the chip
- Use hot air (~380–420°C depending on setup)
- Heat evenly and gently lift the chip
Do not force removal — wait until solder fully melts.
If pads lift → board damage, repair required before proceeding.
Next: Clean both PCB pads and chip underside.
Step 3: Clean PCB and Chip Pads
- Use solder wick to remove old solder
- Clean with IPA
- Ensure pads are flat and shiny
Uneven pads will cause poor contact after reballing.
Step 4: Reball the VRAM Chip
- Place stencil aligned with chip
- Apply solder balls (correct size)
- Heat until balls form properly
If balls merge or misalign → redo reballing.
Uniform ball shape is critical for proper contact.
Step 5: Reinstall the Chip
- Apply flux on PCB pads
- Align chip carefully
- Heat evenly until chip settles
Chip should self-align when solder melts.
Step 6: Post-Reball Checks
- Check resistance on memory rail
- Ensure no shorts
- Inspect alignment under microscope
Step 7: Final Testing
- Power ON and check POST
- Run MATS / MODs again
- Perform stress testing
No errors or artifacts indicate successful reballing.
Key Notes
- Reballing fixes solder joint issues, not faulty chips
- If issue persists → replace VRAM IC
- Always use correct ball size and temperature control
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